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Services
Detailed Microfabrication Capabilities
Design capabilities:
- Transducer types: Piezoresistive, piezoelectric, capacitive, resonant
- Microcantilevers, with or without tips
- Microfluidics
Process capabilities:
- Mask design and layout in .TDB or .GDS format
- Contact lithography to 2 um and stepper lithography to 0.35 um
- All bulk and surface micromachining processes for silicon, glass, and quartz, on 100 or 150 mm diameter substrates up to 10 mm thick (non-standard substrate shapes on a case-by-case basis)
- CMOS-compatible processes
- MEMS over pre-fab CMOS
- Polymer micromachining using SU-8 and PDMS
- Less common thin film materials, such as AlN, ZnO, Pt, and others
- Limited capabilities for sapphire, III-V semiconductors, and other substrates
Back-end (via vendors):
- Grind and polish
- Laser coring and drilling
- Dicing
- Wirebonding, die attach, underfill, globbing
- Chip to Flex circuit
Other processes (via vendors):
- Traditional metal machining
- Plastics embossing
- Rapid prototyping stereolithography
- Chemical milling of sheet metal
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