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ServicesModeling
We strongly advocate combining simulation with measurements as the fastest path to development success. MEMS materials properties are highly dependent on process conditions, and so the traditional advantage of finite element analysis, i.e. purely simulation-driven design, is diminished without the inclusion of process-specific materials data.
We use ANSYS/Multiphysics 11.0 and MATLAB software. Some of our MEMS-specific simulation capabilities are:
Failure AnalysisWe have special expertise in fracture mechanics and statistical methodologies for analyzing brittle structures. We can help you understand, analyze, and minimize the fracture risk of your devices, using an integrated approach that combines both finite element analysis and experimental fracture test data. The majority of MEMS devices are fabricated from brittle materials, such as silicon and glass. Designing brittle material structures poses a significant challenge as compared to using ductile materials (e.g. metals), which have an easily measured failure point, the yield stress. They fail when the applied stress at a critically-sized flaw exceeds the fracture toughness of the material. Since the location and sizes of all flaws in a material is essentially unknowable, the failure point of a brittle structure cannot be solved in a deterministic manner. Using strength of materials or “safety factor” analysis methods developed for ductile structures will give incorrect results. |
We use finite element analysis (FEA) methods to examine sensitivity to MEMS design variables, explore the effects of process variation, evaluate design rules, and to develop more focused Design of Experiment fab runs. Our FEA techniques, when applied concurrently with prototype development efforts, can reduce the number of process runs required to converge and verify a new MEMS design. We understand the subtleties of modeling microscale devices that would elude general FEA practitioners.
