Publications

Articles

How to Dice Fragile MEMS Devices
Chip Scale Review, Nov/Dec 2011
Stealth dicing technology eliminates a problematic and yield killing step for many types of MEMS devices.
Predicting the Failure Probability of Device Features in MEMS
IEEExplore Sept 2011
We detail and validate pragmatic FE-based MEMS analysis capabilities.
New Foundry Friends
MICROmanufacturing Sept/Oct 2011
The fabless model continues to flourish in the MEMS industry, despite challenges.
Planning for Successful MEMS Product Development
Commercial Micro Manufacturing July 2011
Executing a successful MEMS product development effort depends on managing three things: the supplier ecosystem, time and budget.
MEMS Makers: Machinists Who Work In Silicon
MICROmanufacturing Jan/Feb 2011
The MEMS industry - despite its use of silicon wafers - has far more in common with producers of custom-machined metal parts.
TSV in MEMS Product Development
Chip Scale Review, Mar/Apr 2011
Through silicon vias can enable improvements in MEMS at three levels: package, chip and device.
TSVs Find Their Way Into Prototypes
3D InCites Nov 2010
A collaboration between Silex and AMFitzgerald enables incorporation of SilVia technology into early prototypes.
MEMS Structural Reliability and DRIE
MEMS Investor Journal, July 2010
Deep reactive ion etch (DRIE) is an essential MEMS fabrication process technology that leaves behind a scalloped surface prone to fracture. Smoother surfaces require slower etches, which are more costly. How smooth is smooth enough?
MEPTEC Member Company Profile
MEPTEC Report, Summer 2010
A.M. Fitzgerald & Associates, a MEMS product development firm located in Burlingame, CA, bridges the gap between new product concept and foundry production.
Maturing MEMS Sector Moves Towards Common Testing Protocols
SEMI, Oct 2010
MEMS companies haven't yet had use for cooperating on standards efforts, with the wide variety of diverse mechanical structures they make, and the process technology IP that's still a core competitive advantage.
MEMS CTO Meeting: Challenges of Small Markets with Big Demands
I-Micronews, July 2010
The real hot button issues at this first MEMS CTO gathering, organized by AMFitzgerald, ChipWorks and Yole Developpement, were how to fund development, and how get products to market faster in their idiosyncratic niches.
MEMS in Medical Devices: the possibilities are endless
Extreme MEMS, Sept 2009
Several presenters from the MEMS industry shed interesting light on MEMS technologies, and their role in the future of medical devices.
A General Methodology to Predict the Reliability of Single-Crystal Silicon MEMS Devices
Microelectromechanical Systems, Aug 2009
We describe and validate a new failure prediction methodology specifically designed for single-crystal microelectromechanical systems (MEMS) devices under general service loadings.
Cost a Major Challenge for Advanced Packaging Solutions
Semiconductor Packaging News, July 2009
New approaches are needed to minimize packaging costs, which comprise the majority of unit cost.
No Rest for the Weary: MEMS Manufacturing Must Press On, with Big Markets Ahead
AMFitzgerald White Paper, Sept 2006
The MEMS industry must strive towards some level of standardization, and foundries should lead the way to enable truly fabless service..

News

Silex Microsystems and A.M. Fitzgerald & Associates Reduce MEMS Development Time by 50%
Nov 2011
Multi-year collaboration enables fast commercialization of MEMS designs through the Silex Sil-Via® platform
Micralyne and A.M. Fitzgerald & Associates Partner to Provide MEMS Design, Rapid Prototyping and Foundry Services
July 2011
Alliance mitigates risk, speeds time-to-market for commercial MEMS devices
AMFitzgerald to Offer Through-Silicon Vias (TSV) in MEMS Prototypes
Oct 2010
Burlingame, CA - AMFitzgerald announces a new capability to include Silex Microsystems' Sil-Via® through-silicon vias (TSV) in the MEMS prototypes it builds for its customers.

Presentations

AMFitzgerald Company Overview
June 2011
Planning for MEMS Product Development
Sensors Expo, June 2011, Rosemont, IL
MEMS for Medical Applications
IEEE-EMBS Meeting, Nov 2010, Stanford, CA
Leveraging Simulation in MEMS Development
Coventor MEMS+IC System Design Symposium, Oct 2010, Woburn, MA
MEMS Structural Reliability and DRIE: How Are They Related?
MEMS Investor Journal Webinar, July 2010, sponsored by Tegal Corporation
What it Takes to Develop New MEMS Products: Reality Check
Microtech 2010, Anaheim, CA, June 2010
Contact Mask Design Principles
Stanford Nanofabrication Facility Open House, April 2004