Our extensive capabilities are the product of real-world experience and an undeniable, authentic passion for cutting-edge technology.

It's a formidable combination that makes us able to expertly cover a lot of topics. These include:

specialty CHIP Design

Process integration

  • Mask layout for contact, stepper, direct write litho

  • Short loop experiments

  • Runsheet development

  • Process tolerancing and windowing

Modeling & Simulation

Microfabrication capabilities

Design
  • Sensors: piezoresistive, piezoelectric, capacitive, resonant, quantum
  • Actuators: electrostatic, piezoelectric, thermal bimorph, magnetic, fluidic
  • Integrated photonic MEMS: sensors, couplers, mirrors and more
  • Microcantilevers, with or without tips
  • Microfluidics, nano- and micro-scale
  • Micromolds and passive structures
  • Silex SilVia® Through Silicon Via
Process
  • Mask design and foundry tapeout
  • Stepper lithography to 0.25 um, mixed-mode and stitching; e-beam lithography
  • All bulk and surface micromachining processes for silicon, glass, InP, Ge, on 150 or 200 mm diameter substrates up to 10 mm thick (non-standard substrate shapes on a case-by-case basis)
  • CMOS- and photonics-compatible processes
  • TSV, TGV and cavity wafers
  • All common thin film materials, including AlN, PZT, KNN, Pt, and others
Back-end
  • Wafer bonding: anodic, polymer, eutectic, fusion
  • Grind and CMP
  • Thin film layer transfer
  • Laser coring and drilling
  • Ultrasonic drilling
  • Dicing, stealth, plasma and saw
  • Wirebonding, die attach, underfill, globbing
  • Chip to Flex circuit
  • Cavity package with gas fill and lidding
Other processes
  • Traditional metal machining
  • 3D printing
  • Nanoimprint lithography (NIL)
  • Chemical milling

Prototyping & Low Volume Manufacturing

Testing

  • 200 mm wafer-level and chip-level probe in-house

  • Electrical and physical test

Package and assembly

  • COTS and custom packages

  • Die attach

  • Wire bond and interconnect

  • Module assembly

Sensor module design

  • Electronics: control, signal processing, and sensor readout

  • System specification and integration

Supply chain creation and management

  • Design for manufacturing

  • Foundry selection

  • Foundry transfer

  • Backend supply chain

Technology strategy consulting

  • Make versus buy analysis

  • Patent landscaping

  • Operations and management consulting

  • Workshops for executives and directors

Contact Us
 

 

Our Global Ecosystem of Trusted Partners

By augmenting our own team with a curated group of accomplished partners, we've created an ecosystem as capable as any vertically integrated company. Yet we have the efficiency and speed of a small team. Many of our partner relationships have endured for over a decade. Our ecosystem includes the sectors represented here, and features: 

 
  • Qualified, trusted vendors and foundries

  • Global supply base

  • Access to unusual materials and capabilities

  • ISO 13485 production with Millar OEM

 
 
 
Download our company overview
We worked with AMFitzgerald to aid in transitioning the fabrication of our sensor technology to a commercially viable manufacturing process. We found their expertise in this area invaluable, guiding us around known pitfalls, serving as a liaison to interact with foundries, and providing key insights into viable paths forward. A great bunch of folks to work with too. Highly recommend.
— Steve Horowitz, President, IC2